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Thermal Design Criteria for Extraordinary Performance of Devices Cooled by Microchannel Heat Sink
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Increasing power dissipation in microprocessors and other devices is leading to the consideration of more capable thermal solutions than the traditional air-cooled fin heat sinks. Microchannel ...
Multi-Objective Optimization to Improve Both Thermal and Device Performance of a Nonuniformly Powered Micro-Architecture
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Integration of different functional components such as level two (L2) cache memory, high-speed I/O interfaces, and memory controller has enhanced microprocessor performance. In this architecture, ...